LEO gets the INSIDE INFO from ASUS (featuring Jon 'Elmor' Sandstrom)

Leo spent some time with ASUS in London, and we managed to get time to sit with some of their key staff to talk about a variety of topics. More info over here: http://bit.ly/2Mnrk7E

(Please note this video was published before but taken down quickly as ASUS put an NDA on publication and didn't really explain it very well at the time.)

Jackie Hsu, Corporate VP and Global Sales Head OPBG (Open Platform Business Group)
Albert Chang, Head of Motherboard Research and Development
Jonathan Chu, Section Manager, ROG Product Manager for Gaming Motherboards
Jon ‘Elmor’ Sandstrom, Hardware R&D Engineer

00:23 CPU socket/chipset compatibility. If a CPU goes beyond TDP, is that overclocking?
04:47 How do Asus engineers remember all of the different models in the range?
05:14 Soldered CPU heat spreaders - why did Intel use TIM?
06:47 With DDR4 should gamers concentrate on high speed or low latency?
08:08 Why is memory compatibility such a headache for motherboard designers and can the user help resolve a problem?
10:24 How many CPU cores does the enthusiast gamer need?
12:00 Jackie Hsu returns to compatibility testing

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As of 27th April 2018:
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